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Integrated Circuit Package table
table started by
dstaff for the Integrated Circuit Base
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| x name | x image | x Also Typed With | x article |
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| x Dual in-line package |
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In microelectronics, a dual in-line package (DIP), sometimes called a DIL package, is an electronic device package with a rectangular housing and two parallel rows of electrical connecting pins, protruding from the longer sides of the package and...
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| x Ball grid array |
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A ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits.
The BGA is descended from the pin grid array (PGA), which is a package with one face covered (or partly covered) with pins in a grid pattern. These pins are...
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| x Plastic leaded chip carrier |
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A Plastic Leaded Chip Carrier (PLCC) is a four-sided “J”-leaded plastic integrated circuit package with pin spacings of 0.05" (1.27 mm). Lead counts range from 20 to 84. PLCC packages can be square or rectangular. Body widths range from .35" to 1.15...
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| x dip-14 | |||
| x LGA 771 |
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Socket J, also known as LGA 771, is a CPU interface introduced by Intel in 2006. It is used in Intel's most recent DP-capable server processors, the Dual-Core Xeons codenamed "Dempsey" and "Woodcrest" and the Quad-Core Clovertown, as well as the new...
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